Experimental Investigation of Using γ-Al2O3 –Water Nanofluid Flow in Aluminum Foam Heat Sink
The interaction between nanofluids and porous structured heat sinks is not well documented. In addition, the micro-miniaturization of electronic components has led to an increase in the heat dissipation rate of electronic chips. The purpose of this study was to investigate experimentally the heat transfer characteristics and thermal performance of an ERG aluminum foam heat sink for the Intel core i7 processor. The aluminum foam heat sink was subjected to a steady flow of γ-Al2O3-water nanofluid covering the entire non-Darcy flow regime (210 to 631 Reynolds numbers). The bottom side of the heat sink was heated with a heat flux between 8.5 and 13.8W/cm2. The γ-Al2O3 nanoparticle concentrations (volume percent) ranged from 0.1vol% to 0.6vol%. The effect of inserting the foam and employing nanofluids with different concentration were investigated. It was found that the presence of the aluminum foam enhanced the average Nusselt number by 20%. In addition, it was observed that Al2O3-water nanofluid at nanoparticle loading of 0.2vol% achieved an optimum enhancement in the average Nusselt number by 37% and 28% at Reynolds numbers of 601.3 and 210, respectively, compared with the pure water.